Integrated Circuit - Spin FV-1, DSP, Multi-Effect / Reverb
The Spin Semiconductor FV-1 is a complete reverb solution in a single IC. With integrated stereo ADC and DACs, the FV-1 can be treated like any other analog component in your product's signal path.
The FV-1 can access a total of 16 programs, 8 are built into the internal ROM and the designer may elect to connect a serial EEPROM with 8 additional programs. By using an external EEPROM, the designer can distinguish his product from others by creating a custom program set without the need for a microprocessor in the system.
With 3 potentiometer inputs, programs may have real time variable parameters such as decay time in a reverb, rate and depth in a chorus or frequency in a filter. These inputs are available as coefficients to your program and may be used independently of each other.
The rich instruction set allows users to program effects of all kinds. With instructions like LOG and EXP, users can easily program audio expansion and compression routines. Integrated digital LFOs and ramp generators allow for programming chorus, flange and pitch shift.
Features
- Integrated stereo ADC and DAC
- 8 internal demonstration programs + 8 external programs
- Easy customization with external EEPROM
- 3 potentiometer inputs for real-time parameter adjustment
- 3.3V operation
- 6 MIPS operation at Fs=48KHz
- 128 instructions/sample clock
- 32K words of delay RAM
- Internal PLL for Fs input clock
- Integrated Power-On-Reset circuit
- LOG and EXP instructions for dynamics
- Green assembly/RoHS compliant
Applications
- Guitar Amps
- Mixers
- Effects Equipment
- Karaoke
- Consumer electronics
- Car audio
- Active loudspeaker crossover and flattening
- Industrial processes
Programs
- Chorus-reverb
- Flange-reverb
- Tremolo-reverb
- Pitch shift
- Pitch-echo
- Reverb 1
- Reverb 2
The DSP core of the FV-1 provides many advanced features and instructions that allow you to create advanced programs to make your product stand out. The DSP core consists of the MAC/ALU where all math and logic instructions take place, the LOG and EXP blocks that perform the log and exponential functions, a 32-register bank separate from the delay RAM and LFO and ramp generators that can offset memory addressing.
Max. ADC-DAC HF response (-3dB) | 15.5 KHz | |
Max. ADC equivalent input noise (A weighted) | -93 dB | |
Max. Analog input impedance | 120 KΩ | |
Max. Analog input voltage range | AVDD+0.5 | |
Max. Analog output impedance | 200 Ω | |
Max. Analog supply voltage | 3.5 V | |
Max. Channel gain mismatch | 0.2 dB | |
Max. Continuous current through VDD or GND | ±100 mA | |
Max. Continuous output current | ±20 mA | |
Max. DAC output noise (A weighted) | -93 dB | |
Max. Digital input voltage range | DVDD+0.5 | |
Max. Digital supply voltage | 3.5 V | |
Max. Input signal current | ±20 mA | |
Max. Maximum input signal level | 3.0 VP-P | |
Max. Maximum output signal level | 3.0 VP-P | |
Max. Output clamp current | ±20 mA | |
Max. Passband flatness | ±0.5 dB | |
Max. Potentiometer control input impedance | 20 MΩ | |
Max. REFP supply current | 50 μA | |
Max. Supply current (AVDD + DVDD) | 70 mA | |
Max. THD (1KHz, -1db from clipping) | 0.03 % | |
Max. Total internal memory delay (@32.768KHz sample rate) | 1.0 seconds | |
Max. X1, X2 internal bias resistance | 14 MΩ | |
Max. X1, X2 internal capacitance | 15 pF | |
Maximum power dissipation | 300 mW | |
Min. ADC-DAC HF response (-3dB) | 14.5 KHz | |
Min. Allowable load resistance | 10 KΩ | |
Min. Analog input impedance | 80 KΩ | |
Min. Analog input voltage range | -0.5 | |
Min. Analog output impedance | 50 Ω | |
Min. Analog supply voltage | -0.5 V | |
Min. Digital input voltage range | -0.5 | |
Min. Digital supply voltage | -0.5 V | |
Min. Maximum input signal level | 2.6 VP-P | |
Min. Maximum output signal level | 2.6 VP-P | |
Min. Potentiometer control input impedance | 10 MΩ | |
Min. REFP supply current | 30 μA | |
Min. SDA and SCK internal pull up - Typical | 3.75 KΩ | |
Min. Supply current (AVDD + DVDD) | 40 mA | |
Min. X1, X2 internal bias resistance | 7 MΩ | |
Min. X1, X2 internal capacitance | 8 pF | |
Package | 28 SOIC 300 MIL | |
Storage temperature range | -50 °C through 150 °C | |
Typ. ADC equivalent input noise (A weighted) | -97 dB | |
Typ. Analog supply voltage | 3.3 V | |
Typ. DAC output noise (A weighted) | -97 dB | |
Typ. Digital supply voltage | 3.3 V | |
Typ. Negative reference | 0 V | |
Typ. Operating temperature | 0 °C through 70 °C | |
Typ. Positive reference | 3.3 V | |
Typ. Supply current (AVDD + DVDD) | 55 mA | |
Typ. THD (1KHz, -1db from clipping) | 0.015 % |
Packaging Dimensions | 0.708 in. × 0.407 in. × 0.089 in. | |
Weight (Packaging) | 0.0032 lbs. |
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